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SOLVIA-TEMP for Temperature Analysis

SOLVIA-TEMP is the heat transfer analysis part of SOLVIA. The program can be employed in linear and nonlinear, steady-state and transient heat transfer analysis. Nonlinear conduction and boundary convection and radiation conditions can be taken into account.

Ground water seepage analysis, including effects of free surfaces, can also be carried out.

Time Integration
The Euler backward method, the trapezoidal rule and the general alpha-family implicit time integration methods can be employed with a lumped or consistent heat capacity matrix. The explicit Euler forward time integration method can be used with a lumped heat capacity matrix.

Iteration Methods
In nonlinear stationary and nonlinear implicit time integration analysis the modified or full Newton-Raphson methods can be used to establish equilibrium to a desired degree of accuracy.

Prescribed temperatures (prescribed total heads in seepage analysis), concentrated and distributed (2-D and 3-D) heat flow loadings and boundary convection and radiation can be imposed. The specified temperatures and heat flows can be a function of time. Convection coefficients can be temperature- or time-dependent. Emissivity coefficients can be temperature-dependent. A slave node temperature can be prescribed to be a combination of master node temperatures.

Boundary Convection and Radiation
Convection and radiation can be specified between an environmental node and a convection/radiation node, line or surface.

SOLVIA-TEMP contains the one, two and three-dimensional continuum heat conduction elements TRUSS, PLANE and SOLID. The elements have the same variable number of nodes as described for SOLVIA except that the TRUSS element only uses 2 nodes.

The FILM element can be used in the coupled temperature and pressure analysis of oil film bearings. See Oil Film Applications.

Material Models
Materials with temperature- and time-dependent isotropic conductivity and temperature-dependent specific heat can be employed for all the heat conduction elements. For PLANE and SOLID heat conduction elements, constant orthotropic conductivities can be applied along material axes specified independently for each element.

The FILM element considers transport of heat by convection and conduction. See Oil Film Applications.

The PLANE and SOLID element types have also a seepage material model available, which can include free surface seepage.

Latent Heat Effects
All conduction material models can be specified to include latent heat effects in order to allow modeling of freezing and melting conditions and other phase change effects. Up to 10 phase change interfaces can be modeled.

Internal Heat Generation
All conduction material models can also include internal heat generation.

Birth and Death Option
All the conduction, convection and radiation elements in SOLVIA-TEMP can be employed with element birth and death option.

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